Horizontal Crack Induces Vertical Crack For-mation in Epoxy Mold Compound for Electronic Packaging

Syed Mohamad Mardzukey Syed Mohamed Zain, Azman Jalar, Maria Abu Bakar, Fakhrozi Che Ani, Mohamad Riduwan Ramli


Epoxy mold compound (EMC) has been widely applied as the packaging material in the electronic industry. It is due to the unique property of EMC such as high temperature stability, low coefficient of thermal expansion (CTE), excellent electrical properties and manufacturability. Despite of superior properties of EMC, several failures have been reported regarding on the electronic packaging application such as crack on the body (EMC). Most of the research reported that the crack defect was originated from the moisture absorption.  This research is intended to examine the phenomenon and effect of moisture absorption on the vertical and horizontal crack formation. A comparison between control and conditioned sample was studied where the conditioned sample was subjected to humidity chamber according to the Moisture Sensitivity Level 3 (MSL3) requirement. Horizontal crack occurrence has been observed at the interface EMC. While vertical crack occurrence could be linked with the horizontal crack. Further analysis suggest that horizontal crack occurrence induced vertical crack occurrence. Thus, controlling moisture absorption pathway probably minimize horizontal crack and prohibit vertical crack occurrence.


BGA component, Epoxy Mold Compound, Horizontal Crack, Moisture Crack, Moisture Sensitivity Level 3, Vertical Crack

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DOI: https://doi.org/10.33180/InfMIDEM2021.406


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