Space transformer connector characterisation for a wafer test system

Bahadir Tunaboylu

Abstract


Standard connections from probe head to PCB for vertical type probe cards in wafer test are individual separate wires in space transformers (STs), traditionally used for device pitches 80 µm and above for quick turn inexpensive solutions compared to multilayer ceramic substrates. There are inherent signal integrity issues using separate wires in controlling impedance, bandwidth, and cross-talk of STs and probe cards.  A method of wiring that includes parallel pairs and twisted pairs is proposed and electrical characterization was performed to establish predictive specifications on the test cards.


Keywords


semiconductor test systems, signal integrity, materials

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References


ITRS roadmap 2015: https://www.semiconductors.org/clientuploads/Research_Technology/ITRS/2015

Yoo, S.K., Kim, T.K., Cho, Y.A. and Yook, J.K.: ‘Optimization for polyimide circuit design of space transformer on probe card’, IEEE Semiconductor Wafer Test Workshop, San Diego, USA, June 2016, S05-01

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Kilicaslan, H. and Tunaboylu, B: ‘Bandwidth improvement techniques on probe cards’, IEEE Semiconductor Wafer Test Workshop, San Diego, USA, June 2006, S07-03


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