Author Details

huang, xiaoguang, China University of Petroleum(East China), China

  • Vol 49, No 2 (2019) - Technologies and Materials
    Simulation on interfacial singular stress-strain induced cracking of microelectronic chip under power on-off cycles
    Abstract  PDF
  • Vol 50, No 1 (2020) - Electronics
    BP neural network in predicting thermal fatigue life of microelectronic chip
    Abstract  PDF