Reliability evaluation of buck converter based on thermal analysis

Mohammad Mojibi, Mehdi Radmehr

Abstract


The design, which is based on the concept of reliability, is impressive. In power electronic circuits, the reliability design has been shown to be useful over time. Moreover, power loss in switches and diodes plays a permanent role in reliability assessment. This paper presents a reliability evaluation for a buck converter based on thermal analysis of an insulated-gate bipolar transistor (IGBT) and a diode. The provided thermal analysis is used to determine the switch and diode junction temperature. In this study, the effects of switching frequency and duty cycle are considered as criteria for reliability. A limit of 150°C has been set for over-temperature issues. The simulation of a 12kW buck converter (duty cycle = 42% and switching frequency = 10 kHz) illustrates that the switch and diode junction temperature are 117.29°C and 122.27°C, respectively. The results show that mean time to failure for the buck converter is 46,432 hours.


Keywords


Reliability; Mean time to failure; Buck converter; Junction temperature

Full Text:

PDF

References


Huangfu Y, Ma R, Liang B, Li Y. “High power efficiency buck converter design for standalone wind generation system”. International Journal of Antennas and Propagation, 1, 1-9, 2015.

Stupar A, Bortis D, Drofenik U, Kolar JW. “Advanced setup for thermal cycling of power modules following definable junction temperature profiles”. Power Electronics Conference (IPEC), Sapporo, Japan, 21-24 June 2010.

Zhang MT, Jovanovic M, Lee FC. “Design and analysis of thermal management for high-power-density converters in sealed enclosures”. Applied Power Electronics Conference and Exposition, Atlanta, Georgia, 23-27 Feb 1997.

Bašić M, Vukadinović D, Polić M. “Analysis of power converter losses in vector control system of a self–excited induction generator”. Journal of Electrical Engineering, 65(2), 65-74, 2014.

Usui M, Ishiko M. “Simple approach of heat dissipation design for inverter module”. Proc. of International Power Electronics Conference (IPEC 2005), Niigata, Japan, 4-8 April 2005.

Lee TT, Mahalingam M. “Application of a CFD tool for system-level thermal simulation”. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 17(4), 564-572, 1994.

Lee Y, Hwang D. “A study on the techniques of estimating the probability of failure”. Journal of Chungcheong Mathematical Society, 21(4), 573-583, 2008.

Stapelberg RF. Handbook of reliability, availability, maintainability and safety in engineering design. 1st ed. London, UK, Springer Science & Business Media, 2009.

Ding Y, Loh PC, Tan KK, Wang P, Gao F. “Reliability Evaluation of Three-Level Inverters”. Twenty-Fifth Annual IEEE Applied Power Electronics Conference and Exposition (APEC), Palm Springs, USA, 21-25 February 2010.

Alavi O, Hooshmand-Viki A, Shamlou S. “A comparative reliability study of three fundamental multilevel inverters using two different approaches”. Electronics, 5(2), 1-18, 2016.

Dhople SV, Davoudi A, Domiínguez-Garciía AD, Chapman PL. “A unified approach to reliability assessment of multiphase DC–DC converters in photovoltaic energy conversion systems”. IEEE Transaction on Power Electronics, 27(2), 739-751, 2012.

Arifujjaman M, Chang L. “Reliability comparison of power electronic converters used in grid-connected wind energy conversion system”. 3rd IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG), Aalborg, Denmark, 25-28 June 2012.

Khosroshahi A, Abapour M, Sabahi M. “Reliability evaluation of conventional and interleaved DC-DC boost converters”. IEEE Transactions on Power Electronics, 30(10), 5821-5828, 2015.

Rashidi-rad N, Rahmati A, Abrishamifar A. “Comparison of reliability in modular multilevel inverters”. Przeglad Elektrotechniczny (Electrical Review), 88(1), 268–272, 2012.

Javadian V, Kaboli S. “Reliability assessment of some high side MOSFET drivers for buck converter”. International Conference on Electric Power and Energy Conversion Systems, Istanbul, Turkey, 2-4 October 2013.

Ranjbar AH, Abdi B, Gharehpetian GB, Fahimi B. “Reliability assessment of single-stage/two-stage PFC converters”. Compatibility and Power Electronics Conference, Badajoz, Spain, 20-22 May 2009.

Wang H, Ma K, Blaabjerg F. “Design for reliability of power electronic systems”. 38th Annual Conference on IEEE Industrial Electronics Society, Montreal, Canada, 25-28 October 2012.

Richardeau F, Pham TT. “Reliability calculation of multilevel converters: Theory and applications”. IEEE Transactions on Industrial Electronics, 60(10), 4225-4233, 2013.

Lyu MR. Handbook of software reliability engineering. 1st ed. New York, NY, USA, IEEE computer society press, 1996.

Denson WA. “Tutorial: PRISM”. RAC Journal, 1-6, 1999.

Telcordia Technologies. “Special Report SR-332: Reliability Prediction Procedure for Electronic Equipment (Issue 1)”. Telcordia Customer Service, Piscataway, USA, 2001.

SAE G-11 Committee. “Aerospace Information Report on Reliability Prediction Methodologies for Electronic Equipment AIR5286”. Draft Report, 1998.

Union Technique de L’Electricité. “Recueil de données des fiabilite: RDF 2000. Modèle universel pour le calcul de la fiabilité prévisionnelle des composants, cartes et équipements électroniques”. 2000.

Siemens AG. “Siemens Company Standard SN29500 (Version 6.0). Failure Rates of Electronic Components”. Siemens Technical Liaison and Standardization, 1999.

British Telecom. “Handbook of Reliability Data for Components Used in Telecommunication Systems”. London, UK, 1987.

Pecht MG, Nash FR. “Predicting the reliability of electronic equipment [and prolog]”. Proceedings of the IEEE, 82(7), 992-1004, 1994.

“MIL-HDBK-217F (Notice 2). Military handbook: Reliability prediction of electronic equipment”. Department of Defense, USA, 1995.

Abdi B, Ranjbar AH, Gharehpetian GB, Milimonfared J. “Reliability considerations for parallel performance of semiconductor switches in high-power switching power supplies”. IEEE Transactions on Industrial Electronics, 56(6), 2133-2139, 2009.

Rausand M, Hoyland A. System reliability theory: Models, statistical methods, and applications. 2nd ed. New York, NY, USA, Wiley, 2004.

Chan F, Calleja H. “Reliability estimation of three single-phase topologies in grid-connected PV systems”. IEEE Transactions on Industrial Electronics, 58(7), 2683–2689, 2011.

Graovac D, Purschel M. “IGBT Power losses calculation using the data-sheet parameters”. Infineon Application Note, Neubiberg, Germany, 2009.

Fuji Electric Device Technol. Co. Ltd. “Fuji 2MBI150U2A-060 600V/150A IGBT module datasheet”. Fuji IGBT Modules Application Manual. Application Note, Feb 2004.

Ma K, Munoz-Aguilar RS, Rodriguez P, Blaabjerg F. “Thermal and efficiency analysis of five-level multilevel-clamped multilevel converter considering grid codes”. IEEE Transactions on Industry Applications, 50(1), 415-423, 2014.




DOI: https://doi.org/10.33180/InfMIDEM2018.404

Refbacks

  • There are currently no refbacks.


Copyright (c) 2019 Informacije MIDEM